APHC-03502-MT

Sealed & lapped for multi-module applications
RoHs and Reach compliant
Solid-state reliability
All types of modules can be bonded using heat sink bonder
Built with high temperature solder with the ability to withstand <200°C assembly processing temperatures for short periods of time
High strength for rugged environments
High integrity nickel diffusion barriers on elements
Max. delta T performance up to 76°C
Single-stage modules can create systems which are effective from a few mW to few hundred Watts of cooling power
Porched style for enhanced leadwire strength
Bespoke designs available